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India's SENSEX30 index opened 0.06% lower at 81,476.76 points. Among the constituent stocks, State Power of India opened 0.79% higher, Mahengda Information Technology rose 0.56%, and Tata Motors rose 0.5%; In terms of decline, HDFC BANK opened 0.74% lower, Bharti Telecom fell 0.68%, and Unilever of India fell 0.53%.Sources: The Bank of Japan tends to keep interest rates unchanged next week. Five sources familiar with the Bank of Japan's thinking said that the Bank of Japan tends to keep interest rates unchanged next week because policymakers tend to spend more time examining overseas risks and clues about salary increase next year. Any similar decision will increase the possibility that the Bank of Japan will raise interest rates at its meeting in January or March next year, when there will be more information about the wage increase next year. The source also said that there was no consensus within the Bank of Japan on the final decision, and some people in the Committee still believed that Japan had met the conditions for raising interest rates in December. This decision will depend on each member's belief in the possibility of achieving wage-driven sustained price increases in Japan. If upcoming events, such as next week's meeting of the Federal Reserve, trigger another sharp fall in the yen, thus intensifying inflationary pressure, the Bank of Japan may also agree to raise interest rates. But overall, many BoJ policymakers seem to be in no hurry to pull the trigger.An earthquake of magnitude 4.0 occurred in the waters near the Fukushima Daiichi nuclear power plant in Japan. According to Japanese media reports, an earthquake of magnitude 4.0 occurred on the morning of the 12th local time in the eastern coastal area of Fukushima Prefecture, Japan, with a focal depth of 50 kilometers. Fukushima Prefecture has a sense of earthquake in many places, including Urachi-CHO, Langjiang-CHO and Yuye-CHO, among which Urachi is the location of Units 1 to 4 of the Fukushima Daiichi nuclear power plant. (CCTV News)

Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)Indian Trade Secretary: India's export performance is very good. India's service trade will soon reach 50% of the total trade volume.Korean Air passed the US antitrust review, clearing the way for completing the Asiana Airlines transaction.

Israel's Mossad Director held talks with Qatar's Prime Minister on promoting the ceasefire negotiations in Gaza. Two Israeli sources revealed that Israel's Intelligence and Secret Service (Mossad) Director Barnea visited Doha, Qatar, on the 11th and held talks with Qatar's Prime Minister and Foreign Minister Mohammad. The two sides focused on promoting the ceasefire negotiations in Gaza.Indian Trade Secretary: India's export performance is very good. India's service trade will soon reach 50% of the total trade volume.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)